TitleProduct

PCB Design and Assembly Service

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Guangdong

  • Validity to:

    Long-term effective

  • Last update:

    2019-11-28 22:01

  • Browse the number:

    102

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Company Profile

Shenzhen Jingxin Electronic Technology Co., Ltd.

By certification [File Integrity]

Contact:jingxin2019(Mr.)  

Email:

Telephone:

Phone:

Area:Guangdong

Address:Guangdong

Website:http://www.pcbassemblyems.com/ http://jingxin2019.wfzyq.com/

PRODUCT DETAILS

About Us

Shenzhen Jingxin Electronic Technology Co., Ltd. (JXE) is a 16-year professional company dedicating to PCB and PCBA products, providing world-class electronics manufacturing services and OEMs. Since foundation of 2002, with a spirit of specialty, the company has accumulated a group of engineering team and procurement team with more than 10 years professional experience.

We provide one-stop integrated manufacturing service from professional engineering service→PCB manufacture→component purchase→ supply chain management→PCBA manufacture→assembly, aging test to maintenance and development.


PCB Assembly Services

PCB design and assembly service

Quick-turn prototype assembly

Turn-key assembly

Partial turn-key assembly

Consignment assembly

RoHS compliant lead-free assembly

Non-RoHS assembly

Conformal coating

Final box-build and packaging


PCB Assembly Process

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing


Testing Services

X-Ray (2-D and 3-D)

BGA X-Ray Inspection

AOI Testing (Automated Optical Inspection)

ICT Testing (In-Circuit Testing)

Functional Testing (at the board & system level)

Flying Probe


Capabilities

Surface Mount Technology / Parts (SMT Assembly)

Through-Hole Device / Parts (THD)

Mixed Parts: SMT & THD assembly

BGA / Micro BGA / uBGA

QFN, POP & lead-less chips

2800 pin-count BGA

0201 / 1005 passive components

0.3 / 0.4 Pitch

PoP Package

Flip-chip under-filled CCGA

BGA Interposer / Stack-up and more…


http://www.pcbassemblyems.com/